cystech electronics corp. spec. no. : c303n3-a issued date : 2005.12.02 revised date : 2013.09.27 page no. : 1/6 BAS16N3 cystek product specification high ?speed switching diode BAS16N3 description the BAS16N3 is a high-speed switching diode fabric ated in planar technology, and encapsulated in a small sot-23 plastic smd package. equivalent circuit outline BAS16N3 sot-23 features ? small plastic smd package ? high switching speed: max. 4ns ? continuous reverse voltage: max. 100v ? repetitive peak reverse voltage: max. 110v ? repetitive peak forward current: max. 500ma . applications ? high-speed switching in hybrid thick and thin-film circuits. ordering information device package shipping BAS16N3-0-t1-g sot-23 (pb-free lead plating and halogen-free package) 3000 pcs / tape & reel cathode nc anode 2 1 3 1 anode 2 not connected 3 cathode environment friendly grade : s for rohs compliant products, g for rohs compliant and green compound products packing spec, t1 : 3000 pc s / tape & reel, 7? reel product rank, zero for no rank products product name
cystech electronics corp. spec. no. : c303n3-a issued date : 2005.12.02 revised date : 2013.09.27 page no. : 2/6 BAS16N3 cystek product specification absolute maximum ratings @t a =25 : parameters symbol min max unit repetitive peak reverse voltage v b rrm b - 110 v continuous reverse voltage v r - 100 v continuous forward current ( note 1 ) i b f b - 215 ma repetitive peak forward current i frm 500 ma non-repetitive peak forward current @square wave, tj=25 : prior to surge t=1 b j b - 150 c storage temperature t b stg b -65 +150 c note 1: device mounted on an fr-4 pcb. electrical characteristics @ tj=25 : unless otherwise specified parameters symbol conditions min typ. max unit forward voltage v f i f =1ma i f =10ma i f =50ma i f =150ma - - 715 855 1 1.25 mv mv v v reverse current i r v r =25v v r =100v v r =25v,tj=150 : v r =100v,tj=150 : - - 30 1 30 50 na ?
cystech electronics corp. spec. no. : c303n3-a issued date : 2005.12.02 revised date : 2013.09.27 page no. : 3/6 BAS16N3 cystek product specification typical characteristics recommended soldering footprint forward biased voltage & forward current 0 150 300 450 0 500 1000 1500 2000 forward biased voltage-vf(mv) current-i f (ma) capacitance & reverse-biased voltage 0.1 1 0.1 1 10 100 reverse biased voltage-v r (v) capacitance-cd (pf) power derating 0 50 100 150 200 250 300 0 20 40 60 80 100 120 140 160 ta( o c ), ambient temperature pd(mw), power dissipation
cystech electronics corp. spec. no. : c303n3-a issued date : 2005.12.02 revised date : 2013.09.27 page no. : 4/6 BAS16N3 cystek product specification reel dimension carrier tape dimension
cystech electronics corp. spec. no. : c303n3-a issued date : 2005.12.02 revised date : 2013.09.27 page no. : 5/6 BAS16N3 cystek product specification recommended wave soldering condition product peak temperature soldering time pb-free devices 260 +0/-5 c 5 +1/-1 seconds recommended temperature profile for ir reflow profile feature sn-pb eutectic assembly pb-free assembly average ramp-up rate (tsmax to tp) 3 c/second max. 3 c/second max. preheat ? ? ? ? ?
cystech electronics corp. spec. no. : c303n3-a issued date : 2005.12.02 revised date : 2013.09.27 page no. : 6/6 BAS16N3 cystek product specification sot-23 dimension inches millimeters inches millimeters dim min. max. min. max. dim min. max. min. max. a 0.1102 0.1204 2.80 3.04 j 0.0032 0.0079 0.08 0.20 b 0.0472 0.0669 1.20 1.70 k 0. 0118 0.0266 0.30 0.67 c 0.0335 0.0512 0.89 1.30 l 0.0335 0.0453 0.85 1.15 d 0.0118 0.0197 0.30 0.50 s 0.0830 0.1161 2.10 2.95 g 0.0669 0.0910 1.70 2.30 v 0.0098 0.0256 0.25 0.65 h 0.0000 0.0040 0.00 0.10 l1 0. 0118 0.0197 0.30 0.50 notes: 1.controlling dimension: millimeters. 2.maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.if there is any question with packing specification or packing method, please c ontact your local cystek sales office. material: ? lead: pure tin plated. ? mold compound: epoxy resin family, flammability solid burning class: ul94v-0. important notice: ? all rights are reserved. reproduction in whole or in part is prohibited without the prior written approval of cystek. ? cystek reserves the right to make changes to its products without notice. ? cystek semiconductor products are not warranted to be suitable for use in life-support applications, or systems. ? cystek assumes no liability for any consequence of customer pr oduct design, infringement of pat ents, or application assistance . style: pin 1.anode 2.cathode 3.common connection marking: te 3-lead sot-23 plastic surface mounted package cystek package code: n3 a6 xx date code device code
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